Designed for High-Power Chips: All-Scenario Thermal Management Materials with High Thermal Conductivity and Low Thermal Resistance
Melonbean High Thermal Conductivity Interface Materials
- Introduction
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Melonbean specializes in the development and manufacturing of thermal management materials (thermal conductivity, thermal insulation, fireproofing) and specialty materials. To address increasingly severe thermal challenges, Melonbean not only provides a full range of high-performance Thermal Interface Materials (TIMs) and advanced aerogel insulation solutions but also pioneers the introduction of graphene thermal pads with breakthrough vertical thermal conductivity. Combined with professional thermal simulation and reliability testing capabilities, we provide customers with comprehensive solutions including thermal modeling, product design, and precise material selection, helping to optimize thermal design and effectively save project development time.
Our thermal management solutions are widely used in high-power and extreme computing environments, covering cutting-edge technology fields such as Artificial Intelligence (AI), data centers, communication equipment, New Energy Vehicles (NEVs), automotive electronics, PCs and laptops, as well as aerospace and industrial sectors. We are dedicated to enhancing the long-term reliability and service life of various electronic products.
- Download
- Download the Melonbean Thermal Management Materials (TIM) Product Brochure (2026 Edition), which includes specifications, material properties, and basic thermal conductivity guidelines for the entire product line.
Graphene Thermal Pad (HGP G): Made of high-performance graphene and organic polymers. Unlike traditional graphene materials that only possess lateral thermal conductivity advantages, HGP G features exceptionally strong vertical thermal conductivity, with a thermal conductivity reaching 90~150 W/m-K—more than 10 times that of traditional TIMs. It exhibits ultra-low thermal resistance, high reliability, low density (0.95 g/cm³), and high resilience without the risk of pump-out. It is the optimal thermal dissipation choice for TIM1 chip packaging, high-power GPUs, and intelligent driving chips.
Thermal Pad (HGP): Ultra-soft with a high compression ratio, specifically designed for planar filling in structures with large tolerances, greatly minimizing rebound stress on precision components.
Thermal Gel Pad (HGP PT): Designed to fill microscopic chip gaps, it tightly fills small and irregular chip gaps under extremely low pressure, achieving extremely low interfacial thermal resistance.
One-Part Thermal Gel (HG): Features ultra-low stress and natural tackiness with excellent wetting properties, perfectly conforming to irregular surfaces.
Two-Part Thermal Gel (HF): Automatically levels under low pressure and cures with zero residual stress, effectively protecting precision electronic components from damage.
Thermal Grease (HGR): Possesses excellent thixotropy and wetting properties, resisting pump-out and drying. It achieves a minimum Bond Line Thickness (BLT) of 30 microns, making it especially suitable for automated dispensing or screen printing of ultra-thin interfaces under 50um.
Phase Change Material (HPCM): Solid at room temperature for easy processing; softens and exhibits excellent wetting upon reaching the phase change temperature, drastically reducing interfacial thermal resistance. Ideal for CPU/GPU cooling.
Liquid Metal Pad (HLM): Automatically softens to fill voids at the phase change temperature, providing extremely low interfacial thermal resistance. It offers high reliability with no pump-out and zero organic volatility, typically applied in servers, gaming consoles, GPUs/CPUs/APUs, communication equipment, and automotive electronics.
Thermal Insulator (HI): Provides thermal conduction while offering exceptionally high dielectric strength (>6,000Vac), specifically designed for applications requiring strict electrical isolation.
Thermal Absorber Pad (HTB): A thermal interface material combining high thermal conductivity with specific EMI shielding performance. It effectively conducts heat and eliminates electromagnetic interference, ensuring stable component operation.
Aerogel Thermal Insulation Film (AHI): Utilizes nano-pores to effectively block the direction of heat transfer, lowering the product's surface temperature and eliminating hot spots, which significantly improves end-user tactile comfort.
Aerogel Foam (AHI): Combines excellent insulation capabilities with high compressibility to perfectly fill various irregular spaces, providing dual protection of cushioning and thermal insulation for heat-sensitive components, thereby extending product lifespan.