High-Efficiency Thermal Solutions Engineered for High-Power Density Electronic Equipment
28U Single-Phase Immersion Cooling Tank
- Introduction
- This immersion cooling rack is purposely engineered for high-power density electronic equipment, such as servers, computing clusters, and high-frequency power supply systems, utilizing a single-phase direct immersion cooling solution. By placing the IT equipment in direct contact with a dielectric coolant to achieve high-efficiency heat exchange, it effectively overcomes the thermal bottlenecks of traditional air-cooled racks. It is ideal for data centers, edge computing nodes, industrial control centers, and other scenarios with demanding thermal efficiency requirements. Supporting a maximum heat load of up to 40kW per rack with a system mPUE of 1.075, it delivers exceptional energy-saving performance.
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Overcoming Thermal Bottlenecks: Eliminates the cooling limitations of traditional air-cooled racks. It supports a maximum equipment installation density of up to 40kW—2 to 3 times the capacity of conventional air-cooled systems.
High Performance & Extreme Energy Efficiency: Achieves a heat exchange efficiency of ≥95%, keeping core component temperatures at ≤85°C under full-load operation. It reduces energy consumption by 40%–60% compared to traditional air-cooled racks, driving the system mPUE down to 1.075.
Stable & Environmentally Friendly: Features an MTBF (Mean Time Between Failures) of ≥8,000 hours and an annual coolant loss rate of ≤3%, significantly lowering operation, maintenance, and coolant costs.
Dimensions: Standard model L 1550mm × W 1550mm × H 1710mm.
Power & Equipment Capacity: 3Φ5W, 380VAC, 50Hz/60Hz, 5kW.
Cooling System: Single-phase immersion cooling (fluorinated fluid), supporting a maximum heat load of 40kW per rack.
Ingress Protection (IP) & Weight: Main enclosure is IP54 rated, while the liquid cooling tank chamber achieves IP67 sealing. Empty weight is ≤790kg, and full-fluid weight is ≤2500kg.
Compatible Equipment: Designed specifically for high-power density electronic equipment, including servers, computing clusters, and high-frequency power supply systems.
Applicable Scenarios: Well-suited for environments with rigorous requirements for cooling efficiency and energy saving, such as data centers, edge computing nodes, and industrial control centers.